Are you a human?.ZA/USB | Motherboards | ASUS Global
ASUS ZA/USB – motherboard – ATX – LGA Socket – Z97 overview and full product specs on CNET. ZA/USB Item model number ZA/USB Item Weight pounds Product Dimensions x x inches Item Dimensions LxWxH x x inches Computer Memory Type DDR3 SDRAM Manufacturer ASUS Computer International Direct ASIN B00TXBP1NS Is Discontinued By Manufacturer No Date First Available February 26, /5(). ZA/USB Find another model. Get Product Support. Register Product. CPU / Memory Support. Driver & Tools.
Z97-a-usb31.Are you a human?
ZA/USB optimizes your system in a click through exclusive 5-Way Optimization and also supports the latest USB , SATA Express and M.2 with ultra-fast 10Gb/s transfer ry: Intel-Platform. ZA/USB Item model number ZA/USB Item Weight pounds Product Dimensions x x inches Item Dimensions LxWxH x x inches Computer Memory Type DDR3 SDRAM Manufacturer ASUS Computer International Direct ASIN B00TXBP1NS Is Discontinued By Manufacturer No Date First Available February 26, /5(). ZA/USB If your motherboard BIOS version number is greater than the BIOS version listed above, then you will not need to flash your BIOS. However, if your BIOS version is smaller than the version listed above, then you will need to select and download the latest BIOS to update your system.
Ultra-fast USB 3.1 onboard and one-click total system optimization!
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IDF Spring 2021: Technology Theses
Such a serious forum as IDF could not do without Intel’s “programmatic” statements. And such statements were made, in sufficient quantities.
Who, if not the leader of the industry, set milestones on the path of development of the industry? This time, the company was not limited to the prospect of 2021. Intel CEO Craig Barrett takes a 15-year perspective in his speech. What awaits us in 20021 besides celebrating the 100th anniversary of VOSR?
According to Intel, the current pace of development of semiconductor technologies allows us to hope that in the next 15 years, Moore’s Law will remain in effect, and in 20021 the production of 30 GHz processors on 450 mm (18 inch) silicon wafers will become real. In this case, processors and other chips will have nodes made in compliance with 10 nm (0.010 μm) technical process standards.
Demonstrating the operation of the 3 GHz Pentium 4 processor, Barrett emphasized that the only way out for IT companies struggling to counter the downturn in the industry was by developing and releasing products using the latest technology.
Touching upon the immediate prospects for the introduction of new technologies, the Intel chief drew the attention of the audience to the facts: only three out of 1000 people in India, seven out of 1000 in China and 21 out of 1000 in Brazil have access to the Internet. Such numbers are simply not comparable to 490 out of 1000 for the United States and mean solid growth potential for such countries.
However, in addition to describing the prospects, Intel spoke about the successes achieved. The press conference announced the release of the first 0.13 micron processors using 300 mm silicon wafers at a factory in Hillsboro, Oregon. Thus, Fab D1C became the fifth Intel factory operating in compliance with the 0.13 micron process technology. company representatives also did not hesitate to remind that the transfer of production from 200 mm to 300 mm wafers reduces the cost of processors by 30%, and the use of new 300 mm wafers in combination with a 0.13 micron process to replace the old combination of 200 mm wafers / 0.18 microns technical process, makes it possible to practically quadruple the output of finished chips from one plate.