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TI will start production at TSMC and UMC plants using its 0.13-micron process technology
Texas Instruments announced an agreement with TSMC (Taiwan Semiconductor Manufacturing Co.) and UMC (United Microelectronics Corp.), according to which, starting in the second half of 2021, TI will begin qualifying a 0.13-micron process technology with copper conductors for mass production. The move is a logical continuation of the company’s strategy of reducing costs and increasing profitability by outsourcing production to leading Taiwanese companies, observers say.
In the next few years, TI also plans to start using the 90nm TSMC and UMC processes. TI’s revenue is up 2% in the first quarter compared to the previous quarter, and the company is not going to stop there. In particular, in the future it is planned to increase the share of microcircuits produced by third companies to 20%, that is, twice the current level.
Under the terms of the agreement, TI will carry out production on TSMC and UMC lines using CMOS process with copper conductors of its own design. This sets the company apart from many others who have entered into agreements on joint development or transition to compatible technological processes. For example, currently UMC and AMD are jointly developing a 65-nm process technology for a joint plant in Singapore. As for TSMC, it plans to enter into similar partnerships with Motorola, Philips Semiconductors and STMicroelectronics.
Also in the future, TI’s own factory, DMOS 6, located in Dallas, will be seamlessly upgraded to 300mm plates. The company expects that when the process is qualified, DMOS 6 will be able to produce 5,700 wafers per month by the end of June, and by the end of the year, TI expects a capacity of 10,000 wafers per month.