Are you a human?.SilverStone SST-NT; Nitrogon CPU Cooler, low profile: : Computers & Accessories
SILVERSTONE SST-NTPRO-V2 Sleeve Bearing CPU Cooler. RPM: RPM with PWM Air Flow: CFM Noise Level: Variable CPU Socket Compatibility: Intel Socket LGA / / / / / / / AMD Socket AM4* / AM3 / AM2 / FM2 / FM1 *AM4 bracket for your SilverStone CPU cooler sold separately Model #: SST-NTPRO-V2 Item #: N82E SilverStone unveiled the Nitrogon NT, a low-profile processor cooler for 45nm Intel Core 2 Duo E/E, Pentium Dual Core E and Celeron D and E series processors. The cooler is just 37mm tall, it features a copper base and 90mm fan with a max noise level of 23dBA. The Nitrogon NT is a CPU cooler designed for slim profile systems utilizing 45nm Intel Core 2 Duo processors Product information Product Dimensions 6 x 4 x 2 inches Item Weight ounces ASIN BM78L0U Item model number NT Customer Reviews: out of 5 stars 13 ratings/5(13).
Silverstone nt07-775.SilverStone Technology Co., Ltd.
Silverstone’s NT is designed to be a universal cooling solution for Intel socket processors in HTCP and slim-type chassis. The NT has features normally reserved for more expensive coolers.4/5(32). NT07 – Installation Guide 5 Place the NT cooler on top of the installed CPU, and align the four fasteners with the holes on the motherboard. (Make sure each fastener is oriented as shown, with the arrow directed outward.) Setzen Sie den NTKühler auf . SILVERSTONE SST-NTPRO-V2 Sleeve Bearing CPU Cooler. RPM: RPM with PWM Air Flow: CFM Noise Level: Variable CPU Socket Compatibility: Intel Socket LGA / / / / / / / AMD Socket AM4* / AM3 / AM2 / FM2 / FM1 *AM4 bracket for your SilverStone CPU cooler sold separately Model #: SST-NTPRO-V2 Item #: N82E
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SilverStone Nitrogon NT07-775 Low Profile CPU Cooler
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SilverStone Nitrogon NT Low Profile CPU Cooler | TweakTown
EPOC: New Chip Layout on Kingston Memory Modules
Kingston today unveils new proprietary memory chip layout technology – Elevated Package Over CSP (EPOC). Initially intended to use EPOCs in registered-memory modules with a height of 1.2 inches (3 cm).
In a module with EPOC, DRAM chips are arranged in two overlapping rows. At the top are TSOP (Thin-Small Outline Package) chips, and at the bottom – CSP (Chip Scale Package). There are no electrical contacts between the top and bottom rows, in addition, there is a gap between them, which allows cooling both rows of chips with an air flow.