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SPIE: 157nm lithography just around the corner
Despite delays in development, 157 nm equipment will nevertheless appear on the lithographic instrument market. Such hope is inspired by the roadmaps of the leading manufacturers of lithographic instruments presented at the SPIE Microlithography conference, which include 65 nm (0.065 μm) process technology by 2021 – 2021.
157 nm scanners were announced a few years ago, the start of mass deliveries was expected in 2021 or 2021, but due to technical problems discovered during the development of 157 nm lithography, vendors were forced to postpone the start of deliveries until 2021 – 2021.
One of the main challenges facing 157nm technology is birefringence in calcium fluoride (CaF2), which is used in the lenses. In addition, there is clearly not enough material for the manufacture of high-quality lenses and photoresist, which is unlikely to contribute to the early start of deliveries of 157 nm scanners. There are also forecasts that when the scanners do come out, their cost will go off the scale for $ 25 million.
At the same time, the “big three” lithographic instrument makers ASML, Canon and Nikon claim to have successfully overcome their challenges. Nikon plans to begin shipping a 157nm tool that will be able to create 65nm chips using binary photomasks, and 55 and 35nm chips using phase-shifting masks. The company is going to start deliveries sometime in the second half of 2021.
Canon is developing FS1, a 157nm scanner for processing chips with an element size of 65nm and smaller. Like the Nikon instrument, the scanner uses a mirror-optical (or catadioptric) lens to negate the negative effects of birefringence. Canon plans to start shipping in late 2021 or early 2021.
ASML, in turn, is trying to keep up with the Japanese, developing a 157 nm Micrascan VII instrument. AMSL did not say when it plans to start deliveries, but it is believed that
Micrascan VII deliveries will also not begin until late 2021 – early 2021.