Dual intelligent processors 3.CPU and DRAM Digital Power Design for a 100% Performance Boost on AMD 990FX Platform

 

Dual intelligent processors 3

 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 

Are you a human?.Asus AI Suite 3 | Tom’s Guide Forum

 

ASUS ROG Series AI Suite 3 AI Suite 3 AI Suite 3 is an all-in-one interface that integrates several ASUS utilities and allows you to launch and operate these utilities simultaneously. Installing AI Suite 3 • Ensure that you have an Administrator account before installing AI Suite 3 in Windows® 7 or Windows ® 8 / Windows OS. Feb 26,  · FAQ. 1. Tick to set the Chassis fan’s mode. 2. Click and drag to set the fan’s rotation speed. 3. Click and drag the sliders to adjust the fan’s responsiveness. 4. Click to switch between the CPU and chassis fan screens. 5. Click to select different thermal sensor onboard for chassis Estimated Reading Time: 6 mins. Product description. Based on Intel Z77 chipset, ASUS P8ZV LE features Dual Intelligent Processors 3 with SMART Digi+ Power Control for precise adjustments for CPU & memory providing enhanced performance, efficiency, and stability. P8ZV LE incorporates exclusive ASUS technologies such as: Fan Xpert+ for thermal management and monitoring; 6xUSB ports with USB Boost /5(19).

 

Dual intelligent processors 3.M5A99FX PRO R | Motherboards | ASUS Global

Sep 03,  · AI Suite 3 – Dual Intelligent Processors 5. By Cottontails. September 3, in Cooling. Share Followers 2. Go to topic listing Cooling. Feb 26,  · FAQ. 1. Tick to set the Chassis fan’s mode. 2. Click and drag to set the fan’s rotation speed. 3. Click and drag the sliders to adjust the fan’s responsiveness. 4. Click to switch between the CPU and chassis fan screens. 5. Click to select different thermal sensor onboard for chassis Estimated Reading Time: 6 mins. Dual Intelligent Processors 3 with New DIGI+ Power Control. Dual Intelligent Processors 3 with New DIGI+ Power Control. The world’s first Dual Intelligent Processors from ASUS pioneered twin onboard chips – TPU (TurboV Processing Unit) and EPU (Energy Processing Unit). Third generation Dual Intelligent Processors with New DIGI+ Power Control provides a total CPU, memory and SMART Category: AMD-Platform.
 
 
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JEDEC Announces DDR-II Specifications and Considers DDR400

At the JEDEX Conference currently taking place in Santa Clara, representatives of JEDEC companies have published the first details of the specifications of the second generation of Double Data Rate SDRAM, or simply DDR-II, memory products.

Development of the DDR-II standard to replace the current DDR SDRAM. or DDR-I, has been underway for several months, and the market itself is already quite ripe for migration from the current mass 200/266 MHz versions of DDR SDRAM to faster 333 MHz and 400 MHz products or DDR-II. True, until now JEDEC has not expressed a clear opinion on the DDR400 standardization already presented in the samples by Samsung and Micron. It is quite possible, observers note, that the market will immediately switch from the already ratified JEDEC DDR333 standard to DDR-II. Some company representatives call DDR400 exotic, intended for special applications, and do not see any point in standardizing DDR400 specifications.

Anyway, all DRAM manufacturers are developing DDR-II prototypes. It is expected that such products will begin to appear in samples towards the end of 2021 – early 2021, and the mass DDR-II will become in 2021.

In the near future, JEDEC intends to decide on the final specifications of DDR-II. The final characteristics of the chips will be ready by June, and the specifications of the modules will appear closer to September.

So, let’s summarize the known parameters of the new generation of memory products – DDR-II

  • Command set similar to DDR-I products

  • Supports 4- and 8-bit data packets
  • DDR-II memory clock speeds:
    • For PC and other mainstream markets – 400, 533 and 667 MHz
    • For the high-speed graphics market – 800 and 1000 MHz
  • Bandwidth – 3200 Mb / s
  • First DDR-II products – 512 Mbit chips with 1.8 V supply voltage
  • Packaging – 200-, 220-, and 240-pin FBGA packages
  • CL (CAS Latency) – no half cycles and no interrupt commands
  • Additional specifications for write latency and read latency
  • Posted CAS, differential strobe, off-chip output driver calibration (OCD), on-die termination (ODT), pulse interrupt
  • Interface – SSTL_1.8 I / O
  • 1 KB addressing for 512 Mbit x4 / x8 chips and 2 KB for 512 Mbit x 16
  • 4-bit channel architecture of the pre-fetch block (for DDR-1 – 2-bit)

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